MiJing 3D CPU BGA Reball Stencil for A8 A9 A10 CPU

MiJing 3D CPU BGA Reball Stencil for A8 A9 A10 CPU

Feature:

0.25mm thickness
3D BGA for A8 6 6P A9 6S 6SP A10 7 7P
It is 3D for CPU only.
A8 contains all 6 6P BGA 
A9 contains all 6s 6sP
A10 contains all 7 7P

Feathure:

• Stepped groove design enables stencil to align with tinning position of ic rapidly.
• The square holes design makes it easier to take out the formed solder balls.
• This 3D stencil is easy to use no matter you are a new or expert.
• High success rate of planting tin,the solder balls can be formed once afer you are proficient.
• This 3D planting stencil is thicker than ordinary stencils in the market.Less tendency of deformation makes its using life be longer.