Laurent Perier
MiJing 3D BGA Reball Stencil for iPhone A8/A9/A10/A11/A12/A13/A14/A15
MiJing 3D BGA Reball Stencil for iPhone A8/A9/A10/A11/A12/A13/A14/A15
0.025mm thickness
It is 3D.
A8 contains all 6 6P BGA
A9 contains all 6s 6sP
A10 contains all 7 7P
A11 contains all 8 8P X
Feature:
- Stepped groove design enables stencil to align with the tinning position of ic rapidly.
- The square holes design makes it easier to take out the formed solder balls.
- This 3D stencil is easy to use no matter you are new or an expert.
- The high success rate of planting tin, the solder balls can be formed once after you are proficient.
- This 3D planting stencil is thicker than ordinary stencils in the market. Less tendency of deformation makes its using life be longer.
Type
For A15 iPhone 13 Series
General Information
Brand
MiJing Tools
Compatibility
iPhone Models
- iPhone 6 Plus
- iPhone 6
nishimura
Reparatur