MJ 3D BGA Reball Stencil for A11

MJ 3D BGA Reball Stencil for A11

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180 days
Price in points: 150 points
Reward points: 1 point
In stock

MJ 3D BGA Reball Stencil for A11

0.025mm thickness
3D BGA for A11 iphone 8 8P
It is 3D.
A8 contains all 6 6P BGA 
A9 contains all 6s 6sP
A10 contains all 7 7P

A11 contains all 8 8P


  • Stepped groove design enables stencil to align with tinning position of ic rapidly.
  • The square holes design makes it easier to take out the formed solder balls.
  • This 3D stencil is easy to use no matter you are a new or expert.
  • High success rate of planting tin,the solder balls can be formed once afer you are proficient.
  • This 3D planting stencil is thicker than ordinary stencils in the market.Less tendency of deformation makes its using life be longer.

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